Power Copper Bonding Wire
Introduction /Description
• To cope with the demand of high strength, excellent conductive , reliable bonding wire for the SiC and GaN 3rd generation power semiconductor market like IGBT, Niche-tech is one of the pioneer to develop power copper bonding wire .
• Appropriate doping added that enable high operation temp (250C), consistent bonding wire curvature and bonding strength (pull and shear) against pure copper wire.
• Lower resistivity, higher fusing current and conductivity, better match temperature-expansion coefficient, higher reliability against heavy aluminum wire
• Anti oxidation treatment that enable unsealed wire to operate normally for 14 days long.
• To cope with the demand of high strength, excellent conductive , reliable bonding wire for the SiC and GaN 3rd generation power semiconductor market like IGBT, Niche-tech is one of the pioneer to develop power copper bonding wire .
• Appropriate doping added that enable high operation temp (250C), consistent bonding wire curvature and bonding strength (pull and shear) against pure copper wire.
• Lower resistivity, higher fusing current and conductivity, better match temperature-expansion coefficient, higher reliability against heavy aluminum wire
• Anti oxidation treatment that enable unsealed wire to operate normally for 14 days long.
